Wafers serve as the foundation for semiconductor device fabrication. They provide the surface on which integrated circuits are patterned, enabling mass production of microelectronics for computing, communications, and sensing.
Silicon wafers are the most common semiconductor substrate, valued for their purity, crystalline structure, and scalability. They enable cost-effective chip manufacturing for processors, memory, and sensors.
Diamond substrates offer exceptional thermal conductivity, mechanical strength, and wide band gap properties, making them ideal for high-power, high-frequency, and heat-intensive semiconductor applications.
Silicon dioxide, often deposited from TEOS precursors, is widely used for insulating layers, passivation, and dielectric films, ensuring device stability, electrical isolation, and reliable performance.
Anti-Reflective Layers (ARL) reduce light reflection during lithography, improving critical dimension control and pattern fidelity. They are essential for precision manufacturing at advanced semiconductor nodes.
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Real-time, non-destructive material analysis using cold atmospheric plasma and AI-driven insights
Our benchtop, general purpose system for fast, non-destructive material analysis
Stage Size
Optimized for flat samples and precision surface analysis up to 150mm x 180mm
Flat Samples
Ideal for films, wafers, and coated surfaces requiring high-resolution mapping.
Stable
Secures samples firmly to eliminate vibration and ensure measurement stability.
Environment
Operating conditions between 20–45°C, <1% RH, Dew Point -40°C to -80°C
Robot-arm mounted PlasmaSens for real-time piece-to-piece inspection, inline and offline
Sample Size
Supports a wide range of part sizes for inline or offline inspection.
Full Motion
Enables precise inspection of complex geometries and varied orientations.
Raw Data Signals
Rich, multidimensional data for comprehensive material analysis.
AI-Based
Delivers immediate pass/fail feedback and enables predictive quality control.
PlasmaSens for continuous, real-time monitoring in high-throughput production
Speed
Supports continuous high-throughput inspection in production environments.
Compatibility
Flexible integration with a wide range of roll-based substrates up to 1.5m width.
Wide
Cathodes, NMP solvent w/ binder PVDF, PE separators, AlOx coatings, Anodes, binder.
Environment
Operating conditions between 20–45°C, <1% RH, Dew Point -40°C to -80°C
From advanced manufacturing to energy storage and semiconductors, PlasmaSens enables precision insights that drive higher yield, quality, and efficiency across the world’s most demanding industries.
The California Energy Commission (CEC) today awarded SirenOpt® a grant of $2.4M to advance the development and commercial readiness of its PlasmaSens™ manufacturing intelligence platform to enable the inspection, quality control, and real- time process control of battery electrode manufacturing. Improvements in battery manufacturing are essential to state, national, and global efforts to drive sustainable electricity production, storage, and distribution.
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