Industry

Semiconductors

As chips and packages get more complex, material variation gets more expensive.

Chips and packages keep getting more complex. Each additional layer, die or substrate adds complexity to the design, takes up time and resources, and puts more value at risk when a problem is found late.

Yield depends on material properties that are still measured piecemeal, across several tools. Measuring one property, such as resistivity, across its full range can take more than one instrument. Other properties need separate coupons, contact or destructive tests, and surface tools can miss what lies below the surface.

Results then arrive from different tools at different times, so teams struggle to connect a material change to a yield loss, or to qualify a new material or source quickly.

PlasmaSens™ gives teams a connected view of those properties. One non-contact scan, with no sample preparation, reports several properties at the same locations, letting engineers read them together rather than assemble them from separate reports.

Scan video

It can also reveal variation below the surface that surface tools miss.

That makes it possible to catch drift earlier, rely less on destructive tests, and connect material changes to yield with evidence teams can carry into qualification.

Other areas open for evaluation include chamber build-up, post-CMP residue, buried voids and RDL polymer cure.

What We Measure

Where PlasmaSens Fits

Wafers and MEMS

Resistivity and dopingThermal conductivityPhotoluminescenceXRD crystal qualityAnomalies and defects, such as contaminants, cracks and voids

Packaging

ThicknessDensityYoung’s modulusRelative permittivityContaminantsTSV sidewall condition, conducting or insulating

Deposition chambers

Deposition build-up on walls and componentsResidual impurity buildupParasitic CVD onsetPlasma non-uniformity

Where PlasmaSens Adds Value

Protect Device and Package Reliability

Thickness, density, modulus and permittivity read together can reveal material shifts that affect signal integrity and mechanical reliability.

Catch Yield Risks Earlier

Designed to find material variation before more value is built into a wafer or package.

Rely Less on Destructive Testing

Non-contact scans add data from the part itself, alongside the reference tools teams already trust.

Qualify New Materials Faster

Correlated evidence from one scan helps shorten the path when a new material or source enters production.

Manufacture Better Materials, Faster.

The fastest way to evaluate PlasmaSens™ is with your own material. Book a demo scan, or send us samples and we will return a report.

Book a demo scan